- Plot No.404, Udyog Kendra Extn.-II, Ecotech 3, Greater Noida
- info@kootaichemicals.com
- +91-120 4561693
The 2057 (No-Clean Flux) is a low-solid flux that provides extremely high solderability and reliability in both leaded and
lead-free processes. The unique formulation design makes it an excellent soldering ability and can effectively reduce the
generating of solder balls. In particular, the anti-tin bridge performance of QFP’s parts is also ahead of other products.
The 2057 (No-Clean Flux) is a low-solid flux designed to provide exceptional solderability and reliability in both leaded and lead-free processes. Its unique formulation ensures excellent soldering performance while effectively reducing the generation of solder balls. Notably, the anti-tin bridge performance for QFP parts is superior to other products, making it a reliable choice for high-quality soldering applications.
The 2057 (No-Clean Flux) is a low-solid flux designed to provide exceptional solderability and reliability in both leaded and lead-free processes. Its unique formulation ensures excellent soldering performance while effectively reducing the generation of solder balls. Notably, the anti-tin bridge performance for QFP parts is superior to other products, making it a reliable choice for high-quality soldering applications. This product is primarily composed of isopropanol, mineral oil, and resin-rosin, which contribute to its outstanding properties. The 2057 No-Clean Flux is suitable for both lead and lead-free processes, minimizes tin bridges on connectors and SMT parts, and offers excellent filling performance on plate holds. It ensures smooth solder joints with fewer solder balls and provides uniform flux distribution with low stickiness. The flux can be applied using spray or foam spread methods, making it versatile and easy to use.
The technical data for the 2057 No-Clean Flux includes a clear and transparent appearance, a pH of 5.6, a solid content of 4.0%, and a specific gravity of 0.80±0.005 at 25ºC. It has a shelf life of 12 months and an acid value of 23.0 mg KOH/g. The recommended thinner for this product is X400, and it has a flash point of 17ºC (T.C.C.). These properties ensure that the flux performs reliably under various conditions. To ensure stable soldering performance and electrical reliability, it is crucial to maintain the cleanliness and solderability of the PCB and components. The PCB should be handled with care, using clean, non-fibrous gloves, and the output belt, jaw, and fixture should be kept clean. The 2057 No-Clean Flux can be used for both spray and foaming applications, with visual inspections recommended to ensure uniformity. For health and safety, it is important to avoid skin and eye contact with the flux and to use suitable exhaust devices to remove volatile substances from the working area.
then please contact us on below given number of fill the form
+0120-4561693
Manufacturing best in class silicone Sealants, Thermal Adheasives, Thermal Paste, Conformal Coatings, Silicone Pottings, Industrial Cleaners, Solder fluxes & Dispensor Machines.
© 2024 Kootai New Material Technologies Pvt Ltd
